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課程名稱
【竹科管理局園慶講座】Design-on-Simulation Technology for Advanced Packaging Reliability Life Prediction
熱烈招生中
課程代碼：
13S380
上課時間：
113/11/8 週五 13:30~16:30，共1天3小時。
上課時數：
3 小時
上課地點：
課程費用：
(以下費用已由竹科管理局補助100%)
0元
(科學園區廠商優惠價格需送出報名表後，系統發出報名成功回函確認金額。)
課程目標：
The electronic packaging community has widely used Design-on-Simulation (DoS) technology to design a new packaging structure. Still, it has encountered some challenges in ensuring a trustable simulation result. This course will use wafer-level packaging (WLP) to illustrate the solution methodology and procedure, including the FE model, mechanics theories, controlled mesh size validation, etc.
The main focus of the content will be to provide guidance on how to perform a reliable finite element modeling simulation and integrate it with a suitable reliability life prediction model. It will also cover selecting an appropriate finite element model and theory for advanced packaging. This includes choosing the right element type, controlling mesh size, considering plasticity/creep behavior, determining constitutive equations, and selecting empirical life prediction equations.
This course will cover the following topics：
1.Finite element simulation
2.2D/3D model
3.Material constitutive equations
4.Mesh size control concept
5.Simulation theory/materials/model validation procedure
6.Solder joint reliability life cycle prediction empirical equations
The main focus of the content will be to provide guidance on how to perform a reliable finite element modeling simulation and integrate it with a suitable reliability life prediction model. It will also cover selecting an appropriate finite element model and theory for advanced packaging. This includes choosing the right element type, controlling mesh size, considering plasticity/creep behavior, determining constitutive equations, and selecting empirical life prediction equations.
This course will cover the following topics：
1.Finite element simulation
2.2D/3D model
3.Material constitutive equations
4.Mesh size control concept
5.Simulation theory/materials/model validation procedure
6.Solder joint reliability life cycle prediction empirical equations
修課條件：
半導體產業暨相關系統業者之在職人士或有相關技術需求者。
課程大綱：
1.The evolution of electronic packaging technology
2.Advanced packagings
3.Finite element and design-on-simulation technology
4.The difference and selection between 2D/3D modeling
5.Plasticity and creep material constitutive models
6.Mesh size control concept
7.Simulation theory/materials/model validation procedure
8.Solder joint reliability life cycle prediction empirical equations
9.A trustable reliability life prediction methodology
2.Advanced packagings
3.Finite element and design-on-simulation technology
4.The difference and selection between 2D/3D modeling
5.Plasticity and creep material constitutive models
6.Mesh size control concept
7.Simulation theory/materials/model validation procedure
8.Solder joint reliability life cycle prediction empirical equations
9.A trustable reliability life prediction methodology
課程師資：
講者：江國寧
現任：國立清華大學 動力機械工程學系 講座教授
學歷：美國喬治亞 理工學院博士
專長：Advanced Microsystem Packaging, MEMS/NEMS Design, Nano-Mechanics and Nano-Structure Analysis, Artificial Intelligence Methods, Computational Solid Mechanics, Nonlinear Finite Element Method, and Contact/Crash Analysis.
經歷：
■ 講座教授，國立清華大學
■ Materials (SCI) Guest Editor
■ Materials (SCI) Academic Editor,
■ Journal of Electronic Packaging Associate Editor,
■ IEEE Transactions on Components, Packaging and Manufacturing Technologies (SCI) Editor-in-Chief
■IEEE Transactions on Components, Packaging and Manufacturing Technologies (SCI) Senior Area Editor
■ Journal of Mechanics (SCI) Editor-in-Chief
■ IEEE Access (SCI) Topic Editor
■ 科技部固力學門 學門召集人
■ 國家研究院國家高速網路與計算中心 中心主任
■ IEEE-CPMT 理事
■ 中華民國力學學會 理事長
現任：國立清華大學 動力機械工程學系 講座教授
學歷：美國喬治亞 理工學院博士
專長：Advanced Microsystem Packaging, MEMS/NEMS Design, Nano-Mechanics and Nano-Structure Analysis, Artificial Intelligence Methods, Computational Solid Mechanics, Nonlinear Finite Element Method, and Contact/Crash Analysis.
經歷：
■ 講座教授，國立清華大學
■ Materials (SCI) Guest Editor
■ Materials (SCI) Academic Editor,
■ Journal of Electronic Packaging Associate Editor,
■ IEEE Transactions on Components, Packaging and Manufacturing Technologies (SCI) Editor-in-Chief
■IEEE Transactions on Components, Packaging and Manufacturing Technologies (SCI) Senior Area Editor
■ Journal of Mechanics (SCI) Editor-in-Chief
■ IEEE Access (SCI) Topic Editor
■ 科技部固力學門 學門召集人
■ 國家研究院國家高速網路與計算中心 中心主任
■ IEEE-CPMT 理事
■ 中華民國力學學會 理事長
主辦單位:
國家科學及技術委員會新竹科學園區管理局
執行單位：
財團法人自強工業科學基金會
學員須知：
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- 若遇不可預測之突發因素，基金會保有相關課程調整、取消及講師之變動權。
- 無紙化環境，輕鬆達到減碳救地球，即日起16小時以上課程結業證書或未達16小時課程上課證明皆以電子方式提供。
- 課程嚴禁旁聽，亦不可攜眷參與。
- 優惠方案擇一使用。
☆計畫補助課程不適用於其他基金會優惠方案及不可使用紅利點數折抵費用。
☆計畫補助課程開課後，若因故無法上課，則不予退費。
✨針對園區廠商提供企業內訓課程規劃並享有優惠方案，若有需求可洽03-5623116分機3610鄒小姐。
