講者：
講者：張耀文 特聘教授
現職：國立臺灣大學 電機系/電子所
學歷：美國德州大學奧斯汀校區計算機科學 博士
經歷：
■國立臺灣大學電機資訊學院院長
■國立臺灣大學電機系暨電子所教授/特聘教授
■國立臺灣大學副教務長兼教學發展中心/ 數位學習中心創始主任
■ACM Fellow & IEEE Fellow
■IEEE CEDA 總裁
■IEEE CEDA 的IEEE Fellow Search Committee 主席
■ICCAD General/Program Chair/ISPD General/Program Chair/ASP-DAC Program
Chair
專長：電子設計自動化,積體電路實體設計,異質整合,積體電路可製造性設計,EDA和AI協同設計。
時間：
114/11/24 (一)，13:30~16:30。
演講大綱：
1.Critical technology drivers for advancing semiconductor technologies have
created a world with data explosion, which drives the urgent need for computing
devices with higher performance, better power efficiency, and smaller areas
(lower cost).
2.To achieve the power, performance, and area (PPA) holy grail, we have three
main directions for semiconductors:
(1)More Moore with continued device scaling by using advanced process
technologies.
(2)Beyond CMOS with new materials of higher electron mobility to improve
operating speed and power density, and More-than-Moore with 2.5D or 3D
heterogeneous integration to integrate separately manufactured components into a
higher-level assembly that provides enhanced functionality and improved operating
characteristics.
3. We investigate most expected More-Moore transistor, patterning, and
interconnect technologies to push the limits of continued scaling for better PPA,
study More-than-Moore heterogeneous integration with multiple cross-physics
domain considerations such as system-level, physical, electrical, mechanical,
thermal, and optical effects, address their challenges for advanced circuit and
system designs, highlight current EDA solutions, and identify research
opportunities for the emerging challenges.
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