自強課程
課程名稱
【實務高階課程】VLSI高壓(HV) MOSFET元件工程與製程整合技術
熱烈招生中
本課程將聚焦於 VLSI 高壓(HV)MOSFET 元件技術工程與製程整合,系統性介紹高壓 MOSFET 之元件物理、結構設計與製程實作。內容涵蓋 LDMOS、VDMOS 與 DMOS 等高壓元件之應用與關鍵電性指標,並深入探討電場分佈、崩潰機制、漂移區工程與 RESURF 技術。課程進一步說明高壓 MOSFET 之製程模組、閘極氧化層設計及其與低壓 CMOS 共製程整合所面臨的挑戰,包含 FEOL/BEOL 製程整合與製程變異影響。此外,課程涵蓋佈局設計、ESD 與閂鎖考量、高壓元件電性量測,以及 TDDB、HCI 與熱效應等可靠性與失效機制,培養學員對HV製程及元件設計與量產整合的完整理解。
課程代碼:
15S055
上課時間:
2026/4/23(四) 4/24(五) 9:00~16:00共12小時
上課時數:
12 小時
上課地點:
課程費用:
10000元
(符合超值優惠價格者需送出報名表後,系統發出報名成功回函確認金額。)
超值優惠:
- VIP企業會員價:VIP企業會員可享優惠價格 (按我)
- 會員優惠價: 會員於開課前七天完成報名繳費者可享會員優惠價 9800 元
- 會員紅利折抵:本課程歡迎使用紅利折抵,最高可使用 100 點
(金銀級會員已是最優惠價,無法再使用紅利折抵。)
課程特色:
1. 認知高壓 MOSFET 應用與關鍵電性指標2. 理解電場控制與崩潰機制之設計原理3. 掌握高壓元件關鍵製程技術與設計要點4. 了解高低壓元件共製程整合之挑戰5. 熟悉高壓元件佈局規則與電性量測方法6. 辨識高壓元件主要可靠性問題與退化機制
修課條件:
現職從事IC與電子產品(含LCD光電業)之RD設計、佈局、製造、產品應用與品管、品保、FA相關技術人員 。
課程大綱:
1. Overview of VLSI High-Voltage MOSFET Technologies (VLSI 高壓 MOSFET 技術概論)
Classification and applications of HV MOSFETs (LDMOS, VDMOS, DMOS)
Applications of integrating HV devices in VLSI logic processes
Key electrical metrics: breakdown voltage (BV), on-resistance (Ron), drain current, and safe operating area (SOA)
2. Device Physics and Structural Design of HV MOSFETs(高壓 MOSFET 元件物理與結構設計)
Electric field distribution and breakdown mechanisms
Drift region engineering and doping optimization
RESURF principles and field plate structures
3. Process Modules and Key Fabrication Techniques(HV MOSFET 製程模組與關鍵技術)
Well formation and high-voltage isolation techniques
Drift-region implantation and dose control
Gate oxide thickness design and reliability considerations
Source, drain, and body region engineering
4. Process Integration Strategies for HV MOSFETs (HV MOSFET 製程整合策略)
Co-integration of HV MOSFETs with low-voltage CMOS devices
Process sequencing management
Front-End-of-Line (FEOL) and Back-End-of-Line (BEOL) integration challenges
Impact of process variation on breakdown voltage and on-resistance
5. Layout Design and Electrical Characterization (佈局設計與電性特性)
Layout structures and design rules for HV MOSFETs
Guard ring implementation and isolation strategies
Parasitic effects, ESD, and latch-up considerations
Electrical characterizations for an HV device
Breakdown voltage and SOA measurement methodologies
6. Reliability and Failure Mechanisms of VLSI HV MOSFETs (VLSI HV MOSFET 可靠性與失效機制)
Gate oxide reliability and time-dependent dielectric breakdown (TDDB)
Hot carrier injection (HCI) under high electric fields
Self-heating effects and thermal reliability
Long-term degradation and lifetime concerns
Classification and applications of HV MOSFETs (LDMOS, VDMOS, DMOS)
Applications of integrating HV devices in VLSI logic processes
Key electrical metrics: breakdown voltage (BV), on-resistance (Ron), drain current, and safe operating area (SOA)
2. Device Physics and Structural Design of HV MOSFETs(高壓 MOSFET 元件物理與結構設計)
Electric field distribution and breakdown mechanisms
Drift region engineering and doping optimization
RESURF principles and field plate structures
3. Process Modules and Key Fabrication Techniques(HV MOSFET 製程模組與關鍵技術)
Well formation and high-voltage isolation techniques
Drift-region implantation and dose control
Gate oxide thickness design and reliability considerations
Source, drain, and body region engineering
4. Process Integration Strategies for HV MOSFETs (HV MOSFET 製程整合策略)
Co-integration of HV MOSFETs with low-voltage CMOS devices
Process sequencing management
Front-End-of-Line (FEOL) and Back-End-of-Line (BEOL) integration challenges
Impact of process variation on breakdown voltage and on-resistance
5. Layout Design and Electrical Characterization (佈局設計與電性特性)
Layout structures and design rules for HV MOSFETs
Guard ring implementation and isolation strategies
Parasitic effects, ESD, and latch-up considerations
Electrical characterizations for an HV device
Breakdown voltage and SOA measurement methodologies
6. Reliability and Failure Mechanisms of VLSI HV MOSFETs (VLSI HV MOSFET 可靠性與失效機制)
Gate oxide reliability and time-dependent dielectric breakdown (TDDB)
Hot carrier injection (HCI) under high electric fields
Self-heating effects and thermal reliability
Long-term degradation and lifetime concerns
課程師資:
業界師資
學員須知:
注意事項



